Abstract
In the field of low power electronics, Tunnel field-effect transistors (TFETs) are gaining momentum due to aggressive voltage scaling. To enable scaling of power supply while maintaining a high Ion, a steep subthreshold slope and low I0 are required. A TFET operates as a gated PIN diode under reverse bias with the intrinsic region as the channel.
This study focuses on minimizing I0 in a III-V homojunction PIN diode. I0 or leakage current is the current owing in a PIN diode under reverse bias, that forms the o-state current (Vgate = 0 V) in a TFET. Various surface treatment combinations were performed to study surface leakage, of which, BCB and HCl were the most eective passivation and clean, respectively.
For the first time, in this study, electrical characterization of sub-micron PIN diodes was performed.
Library of Congress Subject Headings
Field-effect transistors--Design and construction; Field-effect transistors--Electric properties--Testing; Tunneling (Physics); Low voltage integrated circuits--Design and construction
Publication Date
9-25-2014
Document Type
Thesis
Student Type
Graduate
Degree Name
Microelectronic Engineering (MS)
Department, Program, or Center
Electrical Engineering (KGCOE)
Advisor
Sean Rommel
Advisor/Committee Member
Santosh Kurinec
Advisor/Committee Member
Karl Hirschman
Recommended Citation
Gaur, Abhinav, "Surface Treatments to Reduce Leakage Current in Homojunction In0:53Ga0:47As PIN Diodes for TFET Applications" (2014). Thesis. Rochester Institute of Technology. Accessed from
https://repository.rit.edu/theses/8652
Campus
RIT – Main Campus
Plan Codes
MCEE-MS
Comments
Physical copy available from RIT's Wallace Library at TK7871.95 .G38 2014