Andrew Baisch

Abstract

This study explores a concept for applying basic packaging materials to an environment of high vacuum. This study identified three basic packaging materials and exposed them to a high vacuum environment to identify visual effects caused by the vacuum. In semiconductor and data storage industries, the machinery needed to ultimately create a computer chip often contains vacuum chambers. A common practice of the industry is to ship this machinery while under a state of high vacuum. There are parts inside these vacuum chambers that need protection from the effects of shock and vibration. By placing a sample of packaging material inside a chamber, pumping the chamber to a state of high vacuum, pumping the chamber back down to atmosphere and opening the chamber, a visual inspection of the material can identify that the material itself has failed to maintain its structure. The conclusion of this study identified one material that may warrant further, more precise research and testing for the possibility of use as a cushioning material under vacuum.

Library of Congress Subject Headings

Packing for shipment--Testing; Integrated circuits industry--Equipment and supplies--Packaging--Evaluation; Vacuum technology; Contamination (Technology)--Prevention

Publication Date

2000

Document Type

Thesis

Department, Program, or Center

Manufacturing and Mechanical Engineering Technology (CAST)

Advisor

Yambach, Frank

Advisor/Committee Member

Olsson, David

Advisor/Committee Member

Franc, Chris

Comments

Note: imported from RIT’s Digital Media Library running on DSpace to RIT Scholar Works. Physical copy available through RIT's The Wallace Library at: TS198.5 .B34 2000

Campus

RIT – Main Campus

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