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This project was a preliminary study of an aluminum/dielectric/aluminum multilayer metallizatiOn scheme. Polyimide and spin on glass were compared using high frequency CV analysis on fabricated capacitors. The simple processing involved showed that good crack-free and adhesive fil s could be formed with both materials although the polyimide was the more ideal CV characteristics. Test masks were generated to measure via resistance and dielectric breakdown in a bi-level structure. The Spin on Glass processing was unsuccessful because of underetching of vias. The polyimide processing was successful displaying good breakdown characteristics but high via resistances.

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