The objective of this project was to investigate the possibility of producing array of microplasma, having aluminum and silicon electrodes, and oxide as a dielectric with cavity size as large as 30x30 μm2. One of the potential applications among many was to use such device as a photodector. A new class of photodectors, hybrid semiconductor-microplasma devices, to exhibit photoresponsivities in the visible and near infrared that are more than an order of magnitude larger than those typical of semiconductor avalanche photodiodes . After fabrication processing, the route causes of failure were determined. Processing problems were diagnosed and process evaluation test structures characterized using optical microscope, and scanning electron microscopy (SEM). Oxide insulation between the metal layers (Aluminum) was tested using a multimeter. Continuity tests revealed a short between the metal electrodes. The application of SEM in this failure analysis of a finished device shows aluminum stringers left in the cavities. This was the confirmation of a potential short previously diagnosed with the multimeter test.
"Investigation of Microplasma Cells Fabricated on Silicon Wafer,"
Journal of the Microelectronic Engineering Conference: Vol. 17:
1, Article 1.
Available at: https://repository.rit.edu/ritamec/vol17/iss1/1