Abstract
Frequently transported packaging goods are more prone to damage due to impact, jolting or vibration in transit. Fragile goods, for example, glass, ceramics, porcelain are susceptible to mechanical stresses. Hence ancillary materials like cushions play an important role when utilized within package. In this work, an analytical model of a 3D cellular structure is established based on Kelvin model and lattice structure. The research will provide a comparative study between the 3D printed Kelvin unit structure and 3D printed lattice structure. The comparative investigation is based on parameters defining cushion performance such as cushion creep, indentation, and cushion curve analysis. The applications of 3D printing is in rapid prototyping where the study will provide information of which model delivers better form of energy absorption. 3D printed foam will be shown as a cost-effective approach as prototype. The research also investigates about the selection of material for 3D printing process. As cushion development demands flexible material, three-dimensional printing with material having elastomeric properties is required. Further, the concept of cushion design is based on Kelvin model structure and lattice structure. The analytical solution provides the cushion curve analysis with respect to the results observed when load is applied over the cushion. The results are reported on basis of attenuation and amplification curves
Library of Congress Subject Headings
Cushioning materials--Testing; Three-dimensional printing--Materials
Publication Date
12-5-2017
Document Type
Thesis
Student Type
Graduate
Degree Name
Packaging Science(MS)
Department, Program, or Center
Packaging Science (CAST)
Advisor
Changfeng Ge
Advisor/Committee Member
Thomas Kausch
Advisor/Committee Member
Alexis Rich
Recommended Citation
Priyadarshini, Lakshmi, "Comparative study on cushion performance between 3D Printed Kelvin structure and 3D Printed Lattice structure" (2017). Thesis. Rochester Institute of Technology. Accessed from
https://repository.rit.edu/theses/9650
Campus
RIT – Main Campus
Plan Codes
PACK-MS