Abstract

A static coating program and a spray/static development program were developed, for use on the Wafertrac 9000 using Kodak Micro Positive 820 resist and developer ZX-934 in order to minimize critical dimension shift and maximize process latitude. By maximizing process latitude, a greater tolerance for process and equipment errors can be achieved. Using the established process, 1.2µm resist lines were produced and critical dimension shift was minimized providing a process with wide process latitude for creating photoresist geometries with dimensions larger than 1.2µm.

Library of Congress Subject Headings

Integrated circuits--Design and construction--Data processing; Photolithography--Data processing; Microelectronics--Data processing

Publication Date

8-9-1985

Document Type

Thesis

Student Type

Undergraduate

Degree Name

Imaging Science (BS)

Department, Program, or Center

School of Photographic Arts and Sciences (CIAS)

Advisor

Lynn Fuller

Comments

Physical copy available from RIT's Wallace Library at TK7874.M36 1985

Campus

RIT – Main Campus

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