Author

Todd Eakin

Abstract

Poly(methylmethacrylate), PMMA, resist samples with varying weight average molecular weights and several non-chlorobenzene casting solvents were characterized utilizing. electron beam lithography. Environmental concerns with chlorobenzene have motivated investigation into alternative casting solvents for PMMA resists. Processing effects of variation in the molecular weight of the PMMA resin were unknown and have been quantified. Weight average molecular weights ranging from 539,000 g/mol to 614,000 g/mol were studied in chlorobenzene resist systems. Chlorobenzene, anisole, butyl-acetate, and propylene glycol monoethyl ether acetate solvents were studied in resist systems of constant weight average molecular weight. A three stage screening, optimization, and confirmation experiment was conducted to characterize the different experimental PMMA resist systems. Pre-bake temperature was the only processing input factor to be affected by solvent type. Weight average molecular weight had no statistically significant effect in performance of any resist sample. Measured performance outputs, patterned linewidth, did not significantly vary between the experimental samples. The solvents, chlorobenzene, anisole, and propylene glycol monoethyl ether acetate, and weight average molecular weights ranging from 539,000 g/mol to 614,000 g/mol gave equivalent performance in PMMA resist systems.

Library of Congress Subject Headings

Polymethylmethacrylate; Lithography, Electron beam

Publication Date

1-1-1997

Document Type

Thesis

Department, Program, or Center

Center for Materials Science and Engineering

Advisor

Smith, Bruce

Advisor/Committee Member

Clark, Robert

Advisor/Committee Member

Arney, John

Comments

Note: imported from RIT’s Digital Media Library running on DSpace to RIT Scholar Works. Physical copy available through RIT's The Wallace Library at: TA455.P58 E19 1997

Campus

RIT – Main Campus

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