Abstract

Emerging and existing technologies will require novel approaches to continue advances in development. Heterogeneous integration of next generation materials, such as 2-D materials and III-V semiconductors, onto existing platforms is a critical step to enabling new, better performing devices. Microtransfer printing (µTP) is a promising technique for integrating device coupons onto supportive platforms. InP coupons are integrated into mixed-dimensional structures by printing onto 2-D materials as part of an electronic device. Etching of next generation materials to define device structures is an integral part of any process. Catalytic wet etching is an alternative to dry etching that may offer improvements for some material systems. This work explores the use of tungsten oxide as a catalyst to anisotropically etch silicon to enable advanced devices. Catalytic wet etching has the potential to be applied to emerging applications including AI and in devices critical for optical systems and energy applications. This research dissertation explores the integration of MacEtch processing into novel fabrication processes and material systems. By investigating previously unexplored catalyst-substrate systems, the documentation of MacEtch is expanded to include increasingly important materials that are both CMOS-compatible and sustainable. Tungsten oxide is demonstrated as a catalytic material for silicon; capable of simultaneously functioning as an active device layer and an etching catalyst and enabling simplified fabrication approaches for emerging memory technologies. By developing heterogeneous integration process workflows, such as micro-transfer printing, and combining them with emerging materials, such as emerging 2-D materials, the utility of MacEtch to address challenges facing emerging process nodes is anticipated. Advanced tools of heterogeneous integration, such as the micro-transfer printing process, are developed to enable integration of III-V semiconductors with two-dimensional materials and the fabrication of mixed-dimensional optoelectronic devices. Collectively, these studies demonstrate how novel fabrication methods can facilitate the integration of advanced materials while addressing key challenges associated with future electronic, photonic, and memory systems

Publication Date

8-6-2026

Document Type

Dissertation

Student Type

Graduate

Degree Name

Microsystems Engineering (Ph.D.)

Department, Program, or Center

Microsystems Engineering

College

Kate Gleason College of Engineering

Advisor

Parsian K. Mohseni

Campus

RIT – Main Campus

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