Abstract

Silicon photonics is an emerging field that aims to integrate traditional digital CMOS logic with micro scale optical components made using silicon onto the same chip in order to overcome recent bottlenecks related to information transfer through copper interconnects. The end goal of silicon photonics is to use optical links, integrated together with modulators (devices that translate between the electrical and optical systems) controlled by traditional CMOS logic, packaged in familiar form factors, and interfaced using traditional digital serial protocols. However, groups involved in the research and development of silicon optical components do not work with these fully integrated designs and instead produce chips that only contain the optical components, with all control handled externally. This creates a need for high channel count source measurement power supplies at a cost and configuration attractive to research groups, of which there are a lack of commercially available options. In addition, due to fundamental limitations of silicon as a lasing material, almost all silicon photonics designs integrate pre-made laser diodes manufactured using other semiconductor materials onto their chips. This so called “heterogeneous integration” when performed at the commercial scale involves processes that are expensive and inflexible. For groups performing research on laser integration who want to experiment with different laser types or wavelengths, a more versatile option is needed. This thesis will begin with an overview of the theory and devices that form the foundation of silicon photonics, then a more detailed discussion of some of the obstacles currently facing research groups will be presented. Finally, some original work addressing these obstacles will be presented: MOSAICS, a low cost, open source, high channel count source measurement unit, and Photonic Wire Bonding (PWB), an emerging heterogeneous integration technique that uses micro scale 3D printing to offer increased flexibility at the trade-off of speed.

Library of Congress Subject Headings

Optoelectronic devices--Testing; Optoelectronic devices--Packaging; Silicon--Optical properties; Photonic devices--Research; Metal oxide semiconductors, Complementary

Publication Date

5-2024

Document Type

Thesis

Student Type

Graduate

Degree Name

Electrical Engineering (MS)

Department, Program, or Center

Electrical and Microelectronic Engineering, Department of

College

Kate Gleason College of Engineering

Advisor

Stefan Preble

Advisor/Committee Member

Carlos Barrios

Advisor/Committee Member

Mark Indovina

Comments

This thesis has been embargoed. The full-text will be available on or around 11/30/2024.

Campus

RIT – Main Campus

Plan Codes

EEEE-MS

Download

Available for download on Tuesday, November 26, 2024

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