Abstract
A kinetic study performed to further the understanding of a novel magnetically aligned anisotropic conductive adhesive (ACA) was performed using differential scanning calorimetry (DSC) and a rheometer, under both isothermal and non-isothermal conditions. Isothermal data was collected at 70, 80, and 90°C, whereas non-isothermal data was collected at 5, 10, 20, and 30°C/min, with results interpreted through the use of an autocatalytic model. For isothermal experiments, the rate of conversion was found to increase with increasing isothermal curing temperature, and this was reflected in the kinetic rate constant. Moreover, the rate constant determined by DSC was found to range from 2.6×10-3 - 5.2×10-3 whereas values of k from 4.6×10-3 - 9.6×10-3 when determined using rheology. Similarly, the rate of reaction generally increased with increasing non-isothermal heating rate and again differences were noted when comparing results obtained from the two models. The activation energies for the rheological and DSC data sets for isothermal runs were 38.2kJ/mol and 61.5kJ/mol respectively. The average fit constant values, ln(A), m, and n, found for the rheological and DSC data sets for isothermal runs were 8.1, 0.61, and 0.73 for rheology, and 15.6, 0.78, and 0.71 for DSC results. For isothermal rheology, the values of m were found to decrease with increasing isothermal temperature, the same was found for n where the values decrease as temperature increases. For isothermal DSC results, the values of m were found to decrease slightly with an increase in isothermal temperature where the value of n stayed relatively the same. For non-isothermal experiments, the rheological and DSC activation energies were found to be 46.5kJ/mol and 60.8kJ/mol respectively. The fit constants, ln(A), m and n found for the rheological and DSC data sets for non-isothermal runs were 11.27, 0.55, and 0.86 for rheology, and 13.4, 0.69, and 0.73 for DSC results. Non-isothermal rheology values of m and n were both found to increase as the non-isothermal cure rate was increased. Non-isothermal DSC values showed a trend of a decreasing value of m with an increasing rate, and a trend of a decreasing value of n with an increase in non-isothermal rate.
Library of Congress Subject Headings
Adhesives--Curing; Adhesives--Thermal properties; Adhesives--Mechanical properties; Anisometry; Rheology; Calorimetry
Publication Date
2024
Document Type
Thesis
Student Type
Graduate
Degree Name
Materials Science and Engineering (MS)
Department, Program, or Center
Chemistry and Materials Science, School of
College
College of Science
Advisor
Christopher Lewis
Advisor/Committee Member
Martin Anselm
Advisor/Committee Member
Matt Miri
Recommended Citation
Kirkpatrick, Connor, "Characterization of Curing Kinetics of an Anisotropic Conductive Adhesive using Rheology and Differential Scanning Calorimetry" (2024). Thesis. Rochester Institute of Technology. Accessed from
https://repository.rit.edu/theses/11723
Campus
RIT – Main Campus
Plan Codes
MSENG-MS