Lithography is one of the most crucial processes that is used in modern integrated circuit (IC) fabrication. Level to level alignment and overlay measurements are key factors within lithographic processes. A stepper with an automated level to level alignment system can significantly improve wafer throughput and therefore increase profit for a company. There are many factors that can either enhance or hinder a tool's ability to align one level on top of another. For the past couple of years, RIT has had a Canon FPA 2000 ill-line stepper in their possession and the automated alignment system has never been utilized, until now. The data that proves this particular tool can and will align levels automatically is shown throughout. Some of the issues that arose throughout the study will also be discussed.
"Development of Automated Alignment Methodology on the Canon I-Line Stepper,"
Journal of the Microelectronic Engineering Conference: Vol. 11:
1, Article 3.
Available at: https://repository.rit.edu/ritamec/vol11/iss1/3