Publication Date


Document Type



Traditionally, microelectromechanical systems (MEMS) have been fabricated using standard surface micromachining or bulk micromachining processes with prior or subsequent CMOS incorporation. Recently, a new hybrid technique known as CMOS enicromachining has been developed allowing for parallel fabrication of mechanical and electrical components. A single axis and dual axis accelerometer have been designed for submission for an ASIMPS alpha run using the CMOS micromachining process. Electrical and mechanical analysis and simulations for the single axis accelerometer have been performed. The sensitivity of the single axis accelerometer has been calculated to be 19.66mV/g neglecting the effects of parasitic capacitance. The released die has been packaged at RIT and a testing method has been determined and modeled.

Included in

Engineering Commons