Abstract
Current models for Information and Communication Technology (ICT) products encourage frequent product replacement with newer versions that offer only minor incremental improvements. This pattern, named planned obsolescence, diminishes user experience and shortens product lifespan. This paper presents the conceptual basis for a two-part integrated approach to combating planned obsolescence in ICT devices. First, design for emotional attachment, which creates products that users enjoy, value, and use for longer. Second, technological adaptability, which anticipates product upgrades and repairs as new technologies emerge. A model interdisciplinary design course in industrial design and sustainability, also described herein, trains students to apply this approach to create innovative ICT products with smaller environmental footprints.
Creative Commons License
This work is licensed under a Creative Commons Attribution-Share Alike 3.0 License.
Publication Date
Spring 3-14-2013
Document Type
Article
Department, Program, or Center
School of Design (CIAS)
Recommended Citation
Lobos, A.; Babbitt, C.W. Integrating Emotional Attachment and Sustainability in Electronic Product Design. Challenges 2013, 4, 19-33.
Campus
RIT – Main Campus
Included in
Educational Methods Commons, Engineering Education Commons, Industrial and Product Design Commons, Sustainability Commons
