A trilayer imaging system, using DuPont Pyralin polyimide as a planarizing layer, an Allied Chemical Accuglass Spin On Glass barrier layer, and an imaging layer of Kodak 820 positive photoresist, has been previously investigated at RIT. This system failed to perform as expected when the polyimide coating lifted off the metal layer it was designed to mask. This project investigates the process previously used and makes an attempt to qualify it. Along with this, a process is proposed which uses the polyirnide as a lift-off material in a reversal process using the same materials and equipment.
McKay, James C.
"Multilayer Resist Imaging Methods,"
Journal of the Microelectronic Engineering Conference: Vol. 1:
1, Article 20.
Available at: https://repository.rit.edu/ritamec/vol1/iss1/20